Taw qhia rau Pem Teb Polishing Pads

Cov ntaub ntawv muaj pes tsawg leeg ntawm cov khoom sib tsoo hauv pem teb (tseem hu ua polishing pads lossis sanding pads) txawv nyob ntawm lawv qhov kev thov thiab cov theem tshwj xeeb ntawm kev ua haujlwm.

Polishing pads-tseem hu ua CMP pads lossis tshuaj lom neeg- cov khoom siv kho tshuab cov ntaub ntawv- ua cov khoom siv tseem ceeb hauv cov tshuaj -Mechanical Polishing (CMP) txheej txheem. Lawv feem ntau yog siv rau cov txheej txheem saum npoo ntawm substrates xws li semiconductor wafers. Feem ntau yog tsim los ntawm cov ntaub ntawv xws li polyurethane, cov ntaub qhwv no tau faib dav dav -raws li lawv cov muaj pes tsawg leeg- rau hauv hom xws li polyurethane, tsis yog - fabrics, natural materials, thiab composite materials. Keeb kwm, kev ua lag luam no tau raug monopolized los ntawm cov lag luam txawv teb chaws; nyob rau hauv lub domestic kev ua lag luam, Dinglong Co., Ltd. stands raws li ib tug neeg sawv cev enterprise nyob rau hauv no sector.

Lawv lub luag haujlwm tseem ceeb thaum lub sij hawm polishing txheej txheem yuav xa cov polishing slurry, xa siab, thiab exerting mechanical kev sib txhuam rau ntawm wafer nto.

Polishing pads feem ntau muaj qhov ntxeem tau microstructure, nrog cov qauv zawj tshwj xeeb tsim rau hauv lawv qhov chaw los txhim kho polishing uniformity.

Cov yam ntxwv tseem ceeb ntawm kev ua haujlwm -xws li hardness thiab groove qauv- yog cov yam ntxwv tseem ceeb ntawm polishing pads, raws li lawv ncaj qha cuam tshuam rau ob qho tib si cov khoom tshem tawm thiab qhov kawg ntawm qhov kawg.